6ES7193-6BP00-0BA0
Siemens 6ES7193-6BP00-0BA0 is a BasePlate for ET 200SP modules, used to mount and electrically connect I/O modules in the ET 200SP distributed I/O system.
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15,95 €
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| Weight | 0,048 kg |
|---|---|
| Dimensions | 4,10 × 12,10 × 2,90 cm |
| Siemens | Siemens |
Siemens 6ES7193-6BP00-0BA0 – BasePlate for ET 200SP distributed I/O systems
The Siemens 6ES7193-6BP00-0BA0 is a BasePlate component used within the ET 200SP modular distributed I/O platform. It provides a mechanical mounting surface and electrical backplane connection for ET 200SP I/O modules. The BasePlate ensures stable installation, reliable communication between modules, and fast replacement or system expansion without rewiring. Designed for compact control cabinets, it supports efficient wiring and easy handling.
Key features and benefits:
• BasePlate for ET 200SP I/O modules
• Ensures mechanical stability and secure electrical connection
• Supports fast module exchange and system expansion
• Compact design optimized for narrow control cabinets
• Part of the modular SIMATIC ET 200SP architecture
Typical applications:
• Distributed I/O in automation systems
• Machine control panels
• Packaging, processing, and assembly equipment
• Industrial control cabinets with modular I/O setups
About the manufacturer:
Siemens is a global leader in industrial automation, providing high-performance modular I/O systems such as the ET 200SP series, known for reliability, compact size and flexibility.
